On July 22, South Korea's JoongAng Ilbo reported that SK Hynix was in talks to acquire Intel's Ohio semiconductor campus – a megaproject with up to eight fabs. However, SK Hynix swiftly denied any such plan, stating it has no acquisition-related intentions. Intel declined to comment on speculation, saying it remains focused on the project's steady progress.

The Ohio One site broke ground in 2022 with initial investment of over $28 billion** for two fabs, but construction has faced multiple delays. The first fab is now expected to be completed by **2030**, with production starting around 2030-2031. The project received up to **$7.865 billion in U.S. CHIPS Act subsidies.

SK Hynix is, however, proceeding with a $3.87 billion HBM advanced packaging facility in Indiana, targeting 2028 operations. Samsung also has wafer fabs in Texas. Amid ongoing U.S. pressure for domestic semiconductor localization, rumors of Korean acquisitions are frequent – but this one proved unfounded.

From ICgoodFind: Rumors fly when supply chains realign – but SK Hynix’s response was clear. The real action isn’t acquisition; it’s HBM packaging in Indiana and organic capacity build-outs.